微型 SMD 晶圆芯片级封装（小）.pdfVIP

ApplicationReport

SNVA009AI–September1999–RevisedDecember2019

AN-1112DSBGAWaferLevelChipScalePackage

ABSTRACT

Thisapplicationnoteprovidesinformationonhandling,assembly,andusageofthedie-sizedballgrid

array(DSBGA)waferchipscalepackage(WCSP).

Contents

1Introduction1

2DSBGATechnologyDescription2

3SurfaceMountAssemblyConsiderations8

4PCBLayout9

5StencilPrintingProcess10

6ComponentPlacement10

7SolderPaste,Reflow,andCleaning10

8Rework11

9Qualification11

10ThermalCharacterization11

11Conclusion11

ListofFigures

1StandardWCSPCrossSections3

2PowerWCSPCrossSection3

3EmbeddedPicoStar(Left)andPicoStarSMT(Right)CrossSection4

4TapeandReelInformation(Example)5

5WCSPePODExample6

6LaserMarkingExample7

7TypicalWCSPSurfaceMountFlow8

8PicoStarSMTNon-SolderMaskDefined(NMSD)PadGeometryRecommendation8

9NSMDandSMDPadDefinition9

ListofTables

1MSLClassifications