基于火花烧蚀法制备的纳米铜颗粒修饰铜铜键合工艺研究.docxVIP

基于火花烧蚀法制备的纳米铜颗粒修饰铜铜键合工艺研究

关键词：火花烧蚀法；纳米铜颗粒；铜铜键合；工艺研究

Abstract:Withtherapiddevelopmentofmicroelectronicstechnology,copper-basedinterconnecttechnologyhasbecomeakeymaterialforsemiconductormanufacturingduetoitsexcellentelectricalconductivityandthermalconductivity.However,traditionalcopperbondingprocesseshaveproblemssuchasinsufficientbondingstrengthandmanyinterfacedefects,whichlimittheirapplicationinhigh-performanceelectronicdevices.Thisstudyaimstopreparenanoscalecopperparticlesthroughthesparkerosionmethodandexploreitsimpactonthec