数字集成电路设计：封装、电源与时钟分配.pptx

Lecture21:

Packaging,Power,Clock

21:Package,Power,andClock2OutlinePackagingPowerDistributionClockDistribution

21:Package,Power,andClock3PackagesPackagefunctionsElectricalconnectionofsignalsandpowerfromchiptoboardLittledelayordistortionMechanicalconnectionofchiptoboardRemovesheatproducedonchipProtectschipfrommechanicaldamageCompatiblewiththermalexpansionInexpensivetomanufactureandtest

21:Package,Power,andClock4PackageTypesThrough-holevs.surfacemount

21:Package,Power,andClock5Chip-to-PackageBondingTraditionally,chipissurroundedbyp