JBB50-10胶订包本机侧胶锅的结构设计.pdfVIP

JBB50-10 胶订包本机侧胶锅的结构设计 摘 要 本课题主要是设计 JBB50-10 胶订包本机侧胶锅的结构，JBB50-10 胶订包本 机侧胶锅是印刷行业中印后加工设备部分。 课题机械设计部分使用 UG 进行计算机辅助设计。首先在 UG 下建立 JBB50-10 胶订包本机侧胶锅的零件的三维模型，然后组装零件建立整体的模型。 再由三维模型建立工程图，记述了机结构设计的工件要求及设计方案。对主要零 件进行了计算校核，从而保证了侧胶锅的性能并尽可能提高其装订速度，满足工 作需要。在温度控制部分完成使用单片机为核心的温度控制器的设计，在该设计 中采用高精度的温度传感器AD590 对温度进行实时精确测量，用超低温漂移高精 度运算放大器 OP07 将温度- 电压信号进行放大，再送入 12 位的 AD574A 进行 A/D 转换，从而实现自动检测，实时显示及越限报警。 本设计充分考虑到其实用性，操作方便，技术参数设置合理，极大地提高了 加工效益。 关键词：JBB50-10 ，印刷机械，侧胶锅，温度控制 - I - JBB50-10 胶订包本机侧胶锅的结构设计 Abstract The main task is to design JBB50-10 Adhesive Binding package this side of the structure of plastic pots, JBB50-10 Adhesive Binding Machine side glue-pot package, which was in the printing industry post press and equipment. Some use mechanical design issues UG for computer-aided design. The first established in UG-10 Adhesive Binding JBB50 package this side glue-pot three-dimensional model, and then the whole assembly of parts to establish the model. By the three-dimensional model of engineering drawings, detailed account of the structural design of the work piece requirements and design. Of the main parts of the check to ensure that the plastic side of the pot as much as possible and improve the performance of its binding speed to meet the needs. In the temperature control of the complete use of the MCU core temperature controller for the design, used in the design of high-precision temperature AD590 temperature sensor for real-time precision measurement, using ultra-low temperature drift operational amplifiers OP07 precision temperature - voltage signals Larger, more into the AD574A to 12 A / D converter, thus