树脂基体对导电胶体积电阻率的影响.docVIP

第 44 卷第 2 期 2013 年 2 月  中南大学学报(自然科学版) Journal of Central South University (Science and Technology)  Vol.44 No.2 Feb. 2013  树脂基体对导电胶体积电阻率的影响 银锐明 1 ，王刘功 1 ，杨华荣 2 ，刘飘 2 ，侯清麟 1 ，李静 1 ，陈琳璋 1 (1. 湖南工业大学包装与材料工程学院，湖南株洲，412008； 2. 湖南利德电子浆料有限公司，湖南株洲，412007) 摘要：以环氧树脂、胺类固化剂 Aradur9506 和片状银粉为原料制配导电胶，通过红外光谱(FT-IR)、扫描电镜(SEM) 等方法进行测试，研究等温固化过程中环氧树脂的官能团数量以及固化剂添加量对导电胶体积电阻率的影响，并 探讨其影响机理。研究结果表明：随着环氧树脂官能团数目的增加，体积电阻率逐渐降低，其中四官能团的环氧 树脂时体积电阻率最低，为 1.299×10 ?4 Ω?cm；随着固化剂质量的增加，体积电阻率呈现先下降后上升的趋势， 当环氧树脂与固化剂质量比为 25:5 时，体积电阻率最低，为 3.112×10 ?4 Ω?cm；体积电阻率与树脂基体的固化收 缩率呈反比例关系，固化收缩率越大，体积电阻率越低。 关键词：导电胶；环氧树脂；固化剂；固化收缩率；体积电阻率 中图分类号：TQ324.8 文献标志码：A 文章编号：1672?7207(2013)02?0526?06  Effect of resin matrix on volume resistivity of conductive adhesive YIN Ruiming 1 , WANG Liugong 1 , YANG Huarong 2 , LIU Piao 2 , HOU Qinglin 1 , LI Jing 1 , CHEN Linzhang 1 (1. College of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412008, China? 2. Hunan LEED Thick Film Paste Co. Ltd., Zhuzhou 412007, China) Abstract: Taking epoxy resin and Aradur9506 as curing agent and flake silver powders, electrical conductive adhesives were prepared. The effects of the functional groups of epoxy resin and the addition of curing agent in isothermal cure on the resistivity of the ECA were investigated by FT-IR method, scanning electron microscopy(SEM)and other means. The results show that the volume resistivity decreases with the increase of the number of epoxy functional groups, and the biggest volume resistivity is 1.299×10 ?4 Ω?cm when four functional groups of the epoxy resin are chosen.The volume resistivity firstly decreases and then increases with the increase of curing agent, and reaches the lowest resistivity of 3.112×10 ?4 Ω?cm when the mass ratio of epoxy resin and curing agent is 25:5. The volume resistivity is proportional with the curing shrinkage.The higher the shrinkage of the matrix curing, the lower the resistivity. Ke