高温压力传感器固态隔离封装技术的研究.pdfVIP

第31 卷 第2 期 电 子 科 技 大 学 学 报 Vol.31 No.2 2002 年4 月 Journal of UEST of China Apr. 2002 高温压力传感器固态隔离封装技术的研究* 张生才** 姚素英 刘艳艳 赵毅强 张 为 (天津大学电子信息工程学院 天津 300072 ) 【摘要】论述了多晶硅高温压力传感器小型化固态隔离封装技术、静电键合技术、不锈钢膜片的选择及 波纹设计技术、激光焊接技术、硅油充灌和硅油隔离技术等。以不锈钢膜片和高温硅油为隔离材料，使传感 器的封装直径缩小到15 mm，在1 mA 电流激励下传感器满量程输出为72 mV，零点稳定性为0.48％F.S/mon， 提高了传感器的可靠性，拓宽了传感器的应用领域。 关 键 词 高温; 压力传感器; 静电键合; 固态隔离; 封装; 硅油充灌 中图分类号 TP212.15; TN305.94 Research on Isolated Solid-state Encapsulation Technology of High-temperature Pressure Sensor Zhang Shengcai Yao Suying Liu Yanyan Zhao Yiqiang Zhang Wei (College of Electronics and Information Engineering, Tianjin University Tianjin 300072) Abstract This paper mainly discusses miniature isolated solid-state encapsulation technology of high-temperature polysilicon pressure sensor, including static electricity bonding ,stainless steel diaphragm selection and rippled design,laser welding,silicon oil infilling, isolation and other technologies used in sensor packaging. By adopting stainless steel diaphragm and high-temperature silicon oil as isolation materials, not only the encapsulation diameter of sensor is as small as 15 mm and under 1 mA drive,its full range output is 72 mV and zero stability is 0.48 ％F.S/mon ,but also the reliability of the sensor is improved and its application is widely broadened. Key words high-temperature; pressure sensor; static electricity bonding; isolated solid-state; encapsulation; silicon oil infilling 硅高温压力传感器以工作温度高、体积小、灵敏度高等优点，在石油测井、汽车检测、航空航 天等领域倍受青睐。但长期以来，封装技术一直是制约传感器发展和广泛应用的重要因素。目前， 传感器封装一般为非隔离封装，它只适用于对传感器芯片和电极金属无腐