AlN陶瓷表面状态对Ti_Ni金属化薄膜粘结性能的影响.pdfVIP

第 21 卷第 1 期 中国有色金属学报 2011 年 1 月 Vol.21 No.1 The Chinese Journal of Nonferrous Metals Jan. 2011 文章编号：1004-0609(2011)01-0152-07 AlN 陶瓷表面状态对 Ti/Ni 金属化薄膜粘结性能的影响 占玙娟, 周灵平 1, 朱家俊, 李德意, 彭 坤 (湖南大学 材料科学与工程学院, 长沙 410082) 摘 要：采用电子束蒸发技术在 AlN 衬底上蒸镀 Ti/Ni 双层金属化薄膜，通过 SEM、EDS 和 AES 等方法分析抛光 AlN 表面状态及与金属化薄膜间的相互作用。结果表明：离子束清洗可去除 AlN 衬底表面疏松层，改变 AlN 衬 底表面状态，提高衬底表面能。结合热蒸发原子的作用，膜基界面处 Al 、N 和 Ti 元素之间产生相互扩散现象， AlN 陶瓷和 Ti 膜的附着机制由未清洗前的简单附着改变为扩散附着，极大提高了金属化薄膜粘结性能，其拉脱强 度达 300 MPa 以上，且无需后续退火处理。 关键词：氮化铝；表面状态；金属化；粘结性能；离子束 中图分类号：TB43，TN305 文献标志码：A Influence of AlN ceramic surface state on adhesion of Ti/Ni metallized thin films 1 ZHAN Yu-juan, ZHOU Ling-ping , ZHU Jia-jun, LI Di-yi, PENG Kun (School of Materials Science and Engineering, Hunan University, Changsha 410082, China) Abstract: Metallized thin films of Ti and Ni on AlN substrate were deposited by E-beam evaporation. AlN ceramic surface state and interaction with metallized thin films were investigated by SEM, EDS and AES. The results indicate that a loosened layer of AlN substrate surface is wiped off by ion beam sputter-cleaning, which can change the state of AlN ceramic surface, and then increase the surface energy. Because of the increasing surface energy and the influence of hot evaporation atoms, the spread among Al, N and Ti exists at the interface, and the adherence mechanism for Ti film and AlN is changed from simple adhesion to spread adhesion during ion beam sputter-cleaning. Thus, the adhesion strength of metallized thin films is impr