湿法清洗和蚀刻化学品简单资料.pptVIP

WET ETCH CLEAN Chemical * Page * Page * Differences between 49%HF, HF(50:1) ,DHF(100:1) The Etch rate: 49%HF HF(50:1)DHF(100:1) on the same condition to the same material . In Backside etch , 49%HF is used to etch the nitride on the back side deposited at Diffusion ,which is much thick ,about 1600A. DHF (100:1) Etch rate is the lowest among the three chemicals,so it is used to preclean ,that is to etch a very thin oxide layer. As to oxide etch , HF(50:1) etch rate is in a reasonable range ,so it is suitable to etch oxide layer completely and safely. Page * BOE (Buffered Oxide Etch) NH