微电铸器件铸层均匀性研究.pdfVIP

15 1 Vol. 15 No. 1 2007 1 Opt ics and Precision Engineering Jan. 2007 1004924X( 2007) 1, 2 1, 2 2 2 杜立群 , 刘海军 , 秦 江 , 朱神渺 ( 1. 大连理工大学教育部精密与特种加工技术重点实验 , 辽宁大连 116023; 2. 大连理工大学 辽宁省微纳米技术及系统重点实验 , 辽宁大连 116023) : , 90 m : U8 , U8 , 240 2 min 2. 5 A/ dm , , , : 铸层均匀性; Fick 第二定律; 正负脉冲电流 :T N405; T G249. 9 : A Study on uniformity of microelectroformed device 1, 2 1, 2 2 2 DU Liqun , LIU Haijun , Q IN Jiang , ZHU henmiao (1.K ey Laboratory f or Precision N ontraditional Machining Technology of Ministry of Education, Dalian University of Technology , Dalian 116023, hina; 2. K ey Laboratory f or M icro/ N ano Technology and System of L iaoning Province, Dalian University of Technology , Dalian 116023, hina) Abstract: A theoretical investigation w as presented to explain the effect of pulsereverse current on the uniformity in microelectroforming, and the microelectroforming experiments of tw o different pulse reverse currents w ith gaps w ere carried out . The tw o pulsereverse currents w ere pulsereverse cur rent w ith gaps and pulsereverse current w ithout gaps in negative current, respectively. T he microde vice in the experiments w as the mold of microfluidic chip w ith feature width of 90 m. All experi ments consisted of three steps: making of U8 resist mold, microelectroforming and removing of 2 U8 resist. With the same w orking time and average current density , 240 min and 2. 5 A/ dm , com parison w as carried out betw een the pulsereverse current experiments and the pulse current experi ment. In