计算机系统结构-Performance.pptVIP

IC Cost Assuming a defect density of 0.6 per cm2 : For the larger die (1 cm on a side), the yield is = [ 1 + 0.6 x 1 / 4.0 ] -4 = 0.57 Thus a 30cm diameter wafer will yield 366 good larger dies. For the smaller die (0.7 cm on a side), the yield is = [ 1 + 0.6 x 0.49 / 4.0 ] -4 = 0.75 Thus a 30 cm diameter wafer will yield 1014 good smaller dies. IC Cost Manufacturing process dictates the wafer cost, wafer yield, defects per unit area (which is a small number) Cost per die grows roughly as the square of the die area Functions included in a die number of I/O pins affect the die size, and thus the die cost Processing a 30 cm diameter wafer with 4-6 metal layers costs about $5000, therefore the costs of the large (1cm) the small (0.7cm) dies are about $13.66, and $4.93 respectively. Distribution of Cost in a Computer 20 OS + Basic Office Suite software 37 I/O Devices Subtotal 6 DVD drive 9 Hard disk 19 Monitor 3 Keyboard and mouse I/O devices 37 Processor Board Subtotal 5 Motherboard with basic I/O support, networking 5 Video card 5 Memory 22 CPU Processor board 6 Cabinet Subtotal 1 Shipping box, manuals 1 Cables, nuts, bolts 2 Power supply, fans 2 Sheet metal, plastic Cabinet % of total cost Subsystem System Microprocessors Minicomputers Mainframes Supercomputers 1995 Y ear 1990 1970 1975 1980 1985 Log of Performance Performance Trends Performance Trends Performance Trends Performance Measures Response Time (Execution Time): the time between the start and the completion of an event Performance = 1 / execution time When Machine X is n time faster than Machine Y, n = performance X / performance Y = execution time Y / execution time X 生产量, 生产能力, 吞吐量 Throughput: the total amount of work done in a given time The throughput of X is 1.5 times higher than Y, means that the number of tasks completed per unit time on X is 1.5 times that on Y. Performance Measures- Throughput Performance Measures Five levels of programs for computer performance evaluation R