多胶云母带粘合剂导热性研究.pdfVIP

2007年全国绝缘材料与绝缘技术专题研讨会论文集 2007年10月·南京 多胶云母带粘合剂导热性的研究 张通，饶保林 (“有色金属及材料加工新技术”教育部重点实验室，桂林工学院，广西桂林541004) 摘要：多胶云母带是广泛应用于大型高压电机的主绝缘材料，其导热性直接影响到空冷电机的温升及绝 缘的可靠性。本文采用保护热流计法导热仪、浸渍法密度计研究了目前应用比较成熟的多胶云母带粘合 剂的热传导性能及其与密度的关系。结果表明：酚类固化体系的导热系数明显高于TOA体系和桐马体系； 酚类固化体系中引入TOA增韧后降低了固化物的导热系数；导热系数与密度存在一定的关系，密度较大 的固化物其导热系数一般也较大． 关键字：大电机主绝缘；多胶云母带；导热系数；密度；环氧树脂固化物 onthermal ofresin—rich Study conductivity mica adhesive tape ZHANG Bao-lin Tong，RAO MaterialsandNew (KeyLaboratoryofNonferrous ProcessingTechnology,MinistryofEducation， Guilin University 541004，ChinaJ ofTechnology，Guilin Abstract：Resin-richmica havebeen usedin insulation．The tapes widely higl：voltagelargegenerator笛main thermal ofwhich influencesthe riseandthe ofmaininsulationof conductivitydkectly tem阼rature reliability mica air-cooled ofdifferentkindsofresin-rich adhesiveswhichwere conductivity generator．Thermal t印e usedatthe timewasstudied heatflowmeter the between widely present byguarded tcclmiquc，andrelationship was thermal and immersionmethodoftheadhesivesalsostudiedinthis conductivitydensityby paper．The resultsshowthatthethermal ofthe resinadhesivecured hardenersis conductivityepoxy byphenolic greater thancuredTOAor TOAas willreducethethermal ofthe by Tong-Ma．Introducingtoughagent conductivity curingsystem．The