SMT封装电路板三维在线检测技术.pdfVIP

第28卷 第2期 传 感 技 术 学 报 V0l_28 No．2 2015年 2月 CHINESE JOURNALOFSENSORSANDACTUATORS Feb．20l5 Three-DmensionalOnlineInspectionTechniquefor SM T PackagingCircuitBoard HERongfang，SUN Changku，WANGPeng ，YANGGuowei (StateKeyLaboratoryofPrecisionMeasuringTechnologyandInstruments，TianjinUniversity，Tianfin300072，China) Abstract：InordertoinspectwhethertheSMTpackagingcircuitboardisdefective，thispaperdesignedandestab— lishedathree—dimensionalonline system based0nstructured—lightsensors．Defectsin theSMT packagingcircuit boardscanbefoundandidentifiedonlineprofitfrom thethree--dimensionalprocessingandanalysisbyusingthesys-- tern．Dualsensorsmeasurementtechnologywasappliedtosolvetheproblem ofinformation occlusion effectively， whichcausedbytheheightdifferenceofcomponents．Dualsensorunifiedcalibrationtechnologywasinvestigated， whichcanobtainmodelparametersofthetWO sensorssimultaneouslyandrealizeunified coordinatesatthesame time．Anadaptiveaccuratealgorithm forextractingthestripecenterwasproposed，whichcanrestrainimagenoise causedbylightreflectedandscatteredeffectively．Experimentalresultsindicatethatthemeasuringprecisionofthe system canbe0．02mm．Three—dimensionaldatathatobtainedbythemeasurementsystem canprovideareliable three-dimensionalinformationfortheSMT packagingcircuitboarddefectsonlineinspection． Keywords：SMTpackagingcircuitboard；Structured—lightsensor；3D onlinedefectinspection；dualsensorcalibra— tion；extractlightstripecenter EEACC：7210；7130 doi：10．3969／j．issn．1004—1699．2015．O2．025 SMT封装 电路板三维在线检测技术 何荣芳，孙长库 ，王 鹏 ，杨国威 (天津大学精密测试技术及仪器国家重点实验室，天津300072) 摘 要 ：为了检测回流焊接之后SMT(SurfaceMountTechnology)封装电路板是否存在缺陷，设计并搭建了基于线结构光传感 器的SMT封装电路板三维在线检测系统，通过线结构光扫描测量，获取SMT封装电路板表面三维数据。采用双传感器测量 技术 ，有效减少数据丢失；研究了双传感器统一标定技术，可同时实现两个传感器的参数标定和坐标系统一。提fH 自适应 光条中心提取算法 ，对反射或散射影响而形成的光