铜互连多层膜系中自对准CuSiN层的微结构及其热稳定性.pdfVIP

h h B Vol No h ACTA METALLURGICA SINICA Nov pp si
g CuSiN c you e      AWkkIMrQiswA   fOCu dC nm dCuSiN QxJhlOL HRTEM lOA EDS X hPuh XRD CuSiN SiSiO TaNTaCuCuSiNSiC HSiOC H zAFdcWnc CuSiN IN SiN CuSi LE CuSiC HSiOC H cdWncECz sZI CuSiN YnTRS Cu OY SiC HSiOC H hdb pva QxJ CuSiN WnchbS kmr TN TN O TM  A r MICROSTRUCTURE AND THERMAL STABILITY OF CuSiN SELFALIGNED LAYER IN ADVANCED COPPER INTERCONNECT MULTILAYER FILMS LIU Bo TANG Wenjin SONG Zhongxiao XU Kewei State key Lab oratory for Mechanical Behavior of Materials Xian Jiaotong University Xian Correspondent XU Kewei pr ofessor Tel Email kwxumailxjtueducn Supported by National Basic R esearch Pr ogr am of China NoCB and National Natural Science Foundation of China No Manuscript received in revised form ABSTRACT A CuSiN selfaligned layer with nm in thickness was synthesized by a stepreaction b etween plasma and Cu lm surface in RFplasmaenhanced chemical vap or dep osition system The microstructure of SiSiO TaNTaCuCuSiNSiC HSiOC H multilayer stacks was investi TEM EDS and XRD The results indicate that SiN and CuSi layers app eared in gated by using HR b othsides of CuSiN layer and the thermal stability of the interface of CuSiC H dielectric barriers can b e improved by intro ducing CuSiN selfaligned layer which suppressed copp er atom or vacancy diusion into SiC