Interconnect and PackagingLecture 3 Skin Effect.ppt

Interconnect and PackagingLecture 3: Skin Effect Outlines Transmission Line Model Spectrum of Configurations Skin Effect Coaxial Cable I. Transmission Line Model I. Interconnect Model Telegrapher’s equation: I. Interconnect Model I. Interconnect Model (Constants) III. Skin Effect IV. Coaxial Cable IV. Coaxial Cable: Inductance IV. Coaxial Cable: Inductance IV. Coaxial Cable: Inductance IV. Coaxial Cable: Impedance IV. Coaxial Cable: Impedance HW1: Remarks on z900 Chip (Processor) 10x17 sqmm, 38W, 918MHz, 250MIPS 128bits to each L2 cache chip 280um pitch chip to MCM MCM 127x127sqmm, 5xTerabits/s, 459MHz 20 Processors, 8x4MB Memory 11Knets, 95mm max length on critical path 1ns on MCM, 1.4ns off MCM 33um think film pitch, 396um ceramic substrate 101Kpins, 35.3pin/sqcm 4224pins/1735pg to PCB HW1: Remarks Board 553x447sqmm, 1 MCM, 64GB memory, 24 STI 7 mils pitch (3.3width/4sep) 24GB/s IO, 1GB/s bus, 240lines/MBA (6GB/s), 10pairs/STI, 9 signals/1 clock 3516nets, 19,788pins (signals + pg), 8pins/sqcm * * Chung-Kuan Cheng UC San Diego Voltage drops through serial resistance and inductance Current reduces through shunt capacitance Resistance increases due to skin effect Shunt conductance is caused by loss tangent Propagation Constant: Wave Propagation: Characteristic Impedance Propagation Constant: Wave Propagation: Characteristic Impedance AWG (American Wire Gauge Wire Diameter = 2.54x10-(AWG+10)/20 Copper p= 2.2uohm-cm Copper thickness 1oz(/sqft)= 36um Electric Permittivity of Air 8.85x10-12F/m Magnetic Permeability of Air Characteristic Impedance of Air II. Spectrum of Configurations + + + + )( )( )( ) )( )( )( ) )( )( )( ) ( ( ( + + + + ( ( ( ( ( ( ( ( ( ( ( ( Transmission Line ) jwC G jwL R 1111 Lossy and Leaky Inductance ) G jwL R 1110 Lossy LC Line ) jwC jwL R 1101 Lossy Inductance jwL R 1100 Leaky RC Line ) jwC G R 1011 Leaky Resistance ) G R 1010 RC Line ) jwC R 1001 Resistance R 1000 Skin Effect + Permitivity ) jwC G jwL 0111 S