减成法制作双面COF印制电路板工艺研究.pdfVIP

FPCB 2011 No.5 Short Comment Introduction COF 双面COF基板可以极大地缩小基板面积，满足产品的轻、薄、短小的要求，因此对于双 面COF基板的需求也会逐渐增长。减成法工艺是生产FPC产品的主要工艺，技术与设备 都非常成熟。本文对减成法工艺制作双面COF印制板进行了初步研究，讨论了微孔清 洗方法的选择，比较了化学镀铜与黑孔化工艺的优劣，对应用液态感光抗蚀剂时的参 数如曝光能量、显影速度、蚀刻速度及蚀刻压力等进行了优化，得到最佳工艺流程及 工艺参数。 Double-sided COP subtractive process study WANG Yan-yan HE Wei ZHOU Guo-yun CHEN Yuan-ming HE Bo MO Yun-qi ZHOU Hua Abstract Double-sided COF can reduce substrates sizes, and meet the requirement that products should be lighter, thinner and smaller. So double-sided COF will become more and more popular. Subtractive process is the main process of manufacturing FPC. Its technologies and equipment are very mature. This paper preliminary studies how to manufacture double-sided COF using subtractive process, and discusses which cleaning processes are chosen. It also compares electroless copper plating with black hole process. At last this paper optimizes parameters of exposure energy, develop speed, etching speed and etching pressure when using liquid photoresist, getting the best processes parameters. Key words Double-sided COF FPC; process of black hole; liquid photoresist; optimized tests 随着液晶电视和便携式移动设备等数字产品不 芯片朝下安装，线距微细化，可增加可靠性[1] 。 断向着“轻薄短小”化发展，必须实现高密度封装， 最初的COF基板线宽/线距只达到了50 μm/50 μm （裸芯片直接搭载在挠性印制电路板上）COF封装 的程度，随着高密度FPC线路的微细化，单面COF基 作为液晶显示模块的IC封装形式得到了更为广泛的 板的线宽/线距已经可以做到15 μm/15 μm 。COF底材 应用，并逐步代替TCP （Tape Carrier Package ，带载 技术日益发展，适合于COF基板的无粘结层铜箔更加 封装结合）。COF封装的连接方式集成度高，外围组 便于布线微细化，促使双面COF基板的产生。现在双 件可以与IC一起安装在FPC上；结构简单，尺寸缩小 面COF基板的贯通孔孔径可以小于50 μm ，线宽/线距 化，