白光LED封装工艺研究.pdfVIP

16 CH INA L IGHT LIGHT ING 20 10 1 LED 虞倩倩 梁 超 何锦华 (江苏博睿光电有限公司, 南京 211100) 本文通过对封装辅料及涂覆 艺的研究, 分析了LED 荧光粉粒径模条卡点及涂覆方式对白光 LED光学性能的影响实验采用小功率直插式 LED 封装 艺, 结果表明, 选择小粒径的荧光粉可以 显著提高产品的光色均匀性; 使用高卡点的模条及高涂覆方式, 可以提升发光效率 5% 以上; 而采用 相反方式涂覆 艺, 垂直光强可相对增加 30% 以上 白光LED 封装 艺 发光效率 光强 荧光粉 涂覆量 Research On Packaging Technology ofWLED Yu Q ianqian L iang Cha He Jinhua ( Jiangsu Bree Optr nics C . , Ltd. , N anjing 211100) Abstract: The effects f LED ph sph rs particle size, m del bars w edge height and c ating quantity n the ptical pr perties f dipl w p w erW LED are analyzed respectively. R esults sh w that c l r unif rm ity can be mi pr ved bvi usly by ch sing ph sph r w ith sm aller granularity; The lum in us efficacy can be enhanced ver 5% and 30% respectively in the case fm re lum in us quantity and l w erw edge; H w ever, the vertical light in tensity can be increased ver 30% and 70% by using therw isew ay. K ey words: w hite LED; packaging techn l gy; efficacy; light intensity; ph sph r; lum in us quantity , LED LED LED, LED , , 1 , , LED, , 570nm 450 , ~ 4525nm , [ 1- 3] 6 000~ 8 000K LED LED , 50 PM S50 LED LED, LED , 20mA LED 11 [ 4] 2 SH 102 H 102, : LED 17 570nm, 75m 95m