基于硅光子的片上光互连技术的研究.pdfVIP

基于硅光子的片上光互连技术研究 1 1 1 钱磊 ， 吴东 ， 谢向辉 （江南计算技术研究所江苏省 无锡市 214083）1 摘 要 随着芯片半导体工艺的发展，芯片集成度不断提高，单个芯片上所能容纳的计算核心数越来越多， 使得核心间的数据移动效率成为制约整个处理器芯片整体性能关键因素。光互连技术采用波导方式传输数 据，信号传输的损耗低、速度快、延迟小，通过采用波分复用（WDM）技术可以达到很高的带宽密度，有 助于解决片上通信的瓶颈问题。面向未来片上高性能互连的需求，深入分析了电互连技术的现状与局限性， 研究并分析了基于硅光子的光互连技术发展现状和趋势，对比分析了多种典型光互连架构的特点及优缺点， 总结了未来硅光子互连技术需要解决的五个重要问题。 关键词 片上光互连，硅光子，互连架构 中图法分类号 TP302 文献标识码 A The Study of Silicon Photonics based On-chip Optical Interconnect 1 1 1 QIAN Lei , WU Dong , XIE Xiang-hui 1 (Jiangnan Institute of Computing Technology, Jiangsu Wuxi 214083, China) Abstract With the development of semiconductor technology, the chip integration is increasingly improved that more and more computing cores can be integrated in a single chip. The efficiency of data moving between computing cores impacts the performance of whole chip. Optical interconnect using wavelength division multiplex technology has high transmission speed but low signal loss, low transmission delay and power consumption. It will become the potential technology to solve the on-chip communication problem of future multi-core and many-core processors. To meet the needs of future on-chip communications, the features of electrical interconnect and analyzed its limitations. Then, the state-of-the-art and the future trends of optical interconnect technology was studied and its limitation was presented. Based on these works, the features, advantages and drawbacks of some typical on-chip optical interconnection arch