LED封装的热控制优化设计.pdf

SEMICONDUCTOR OPTOELECTRONICS Vol. 31 No. 1 Feb. 2010 LED 刘 波, 洪 峰, 李秋俊, 冯世娟 ( , 400065) : 基于某型LED 模块的实验结果, 从热膨胀匹配冷却技术的选择发光效率焊料及 硅 选择等方面对大功率LED 的热控制问题进行了优化设计实验结果表明, 优化设计后的大功 率LED 的转换效率和光通量等指标都有了一定程度的改善 : LED; ; ; : T N305. 94 : A : 1001- 5868(2010) 01- 0034- 04 Optimization of Thermal Management for High Power LED LIU Bo, HONG eng, LI Qiujun, ENG Shijuan (College of Ele troni Engineering, Chongqing University of Posts and Tele ommuni ations, Chongqing 400065, CHN) Abstra t: Based on the experimental results of a LED module, in terms of the thermal expansion match, the choice of cooling technology, luminous efficiency and the choice of solder and silicagel, an optimal design of thermal management problem is proposed for high - power LEDs. Experimental results of the optimum design show that the conversion efficiency, luminous flux and other indicators of high power LEDs obtain a certain degree of improvement. Key words: LED; reliability; heat sink material; thermal management method 0 , [ 2] , Chau ( LED) (EHD) LED , LED ( HB- LED) , , , [ 1-6] , LED , 21 LED , LED , , , LED , , , [ 1] 1 LED , Cathy LED , LED , 1/ 4 1 , LED PCB L