合金化和形变处理对Cu-Mg-Te-Y合金组织性能的影响.pdfVIP

Trans. Nonferrous Met. Soc. China 23(2013) 3697−3703 Effects of alloying and deformation on microstructures and properties of Cu−Mg−Te−Y alloys Liang CHEN, Bing-wen ZHOU, Jian-ning HAN, Yan-yan XUE, Fei JIA, Xing-guo ZHANG School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China Received 31 December 2012; accepted 13 March 2013 Abstract: New copper alloys with high mechanical properties and high electrical conductivity were prepared, and the effects of addition of minor Mg and Y elements on microstructures and properties were studied. The high tensile strength of above 510 MPa, high elongation of 11% and high electrical conductivity of over 63% IACS can be simultaneously obtained in Cu−0.47Mg−0.20Te− 0.04Y alloy after deforming and annealing treatment. Effects of purification together with the grain refining by Y and solid-solution strengthening by Mg are appropriate for enhancing mechanical properties and electrical conductivity of the copper alloys. Key words: Cu−Mg−Te−Y alloys; alloying; deformation; mechanical properties; electrical conductivity Bi. Until now, it has been reported that Cu−Mg alloys 1 Introduction with trace Mg possess high strength and high conductivity. Moreover, Cu−Te alloys exhibit special Pure copper and copper alloys have been widely properties of easy-cutting and arc-resistance. But Cu−Te applied in many technique fields such as electronic/ a