《Application of timetemperature superposition method in thermal aging life prediction of shipboard cables》.pdfVIP

Vol. 13 No. 4 December 2014 Journal of Chongqing University (English Edition) [ISSN 1671-8224] doi:10.11835/j.issn.1671-8224.2014.04.04 To cite this article: DENG Wen-dong, CHEN Yi-yuan. Application of time-temperature superposition method in thermal aging life prediction of shipboard cables [J]. J Chongqing Univ: Eng Ed [ISSN 1671-8224], 2014, 13(4): 142 -150. Application of time-temperature superposition method in thermal aging life prediction of shipboard cables DENG Wen-dong 1,†, CHEN Yi-yuan 2 1State Grid Chongqing Jiangbei Power Supply Company, Chongqing 401147, P. R. China 2 Chongqing Electric Power College, Chongqing 400053, P. R. China Received 17 September 2014; received in revised form 28 September 2014 Abstract: The life of shipboard cables will decrease due to the complex aging processes. In terms of the safety perspective, remaining life prediction of the cable is essential to maintain a reliable operation. In this paper, firstly, based on Arrhenius equation, residual life of new styrene-butadiene cable is calculated; result indicates that the degradation rate which changes with time is proportional to thermal temperature. Then second order dynamic model is adopted into the residual life prediction, combined with the time-temperature superposition method (TTSP), and a new residual life model is proposed. According to the accelerated thermal aging experiment data and Arrhenius equation, TTSP method demonstrates to be an efficient way for life prediction, and life at normal temperature can be estimated by this model. In order to monitor the state of styrene -butadiene cable more accurately, an improved