大功率LED多芯片集成封装热分析.pdfVIP

SEMICONDUCTOR OPTOELECTRONICS Vol. 32 No.3 June 2011 LED 蚁泽纯, 熊 旺, 王 力, 刘立林, 张佰君, 吴 昊 ( , 510275) : 随着高亮度白光LED 在室内室外照明领域的应用, 多芯片 LED 的集成封装方式 是其发展的 要趋势之一, 而热问题却是多芯片 LED 集成封装的瓶颈问题之一建立了多芯片 LED 集成封装的等效热路模型, 并采用有限元分析( FEA) 的方法对多芯片LED 集成封装的稳态 热场分布进行了分析, 同时通过制作实际样品研究大功率LED 多芯片集成封装的热阻发光效率 与芯片工作数量的关系结果表明集成封装的多芯片白光LED 结温随着集成芯片数量的增加成 线性增长, 芯片到基板底面的热阻随着芯片工作数量的增加而增大, 而其发光效率随着集成芯片数 量的增加成线性减小 : LED; ; ; ; : T N312. 8 : A : 1001- 5868( 2011) 03- 0320- 05 Thermal Analysis of Multichip Pac age of High Power LEDs YI Zec un, XIONG Wang, WANG Li, LIU Lilin, ZHANG Baijun, WU Hao ( State Key Laboratory of Optoelectronic Materials and Technology, Sun Yatsen University, Guangzhou 510275, CHN) Abstract: Wit t e application of ig brig tness LED in indoor and outdoor lig ting, multic ip package is one of t e most promising development trends. How ever, t e eat influence is still t e bottleneck problem w ic restricts t e development of multic ip package. In t is paper, combining t e equivalent t ermal resistance netw ork model of multic ip LED package, t e steady state eat distribution of multic ip LED package w as simulated by using t e finite element analysis ( FEA) met od. A t t e meantime, a multic ip LED sample w as designed and packaged. T e results indicate t at t e junction temperature and t e t ermal resistance of t e c ip from PN junction to t e board increase w ile t e luminous efficiency decreases linearly wit t e number of w orking LED c ips. Key words: multic ip LED; equivalent t ermal resistance netw ork; t ermal resistance; package; finite element analysis( FEA) 0 LED 200 lm/ W , 100 lm/ W LED LED , LED 10 , , LED , , LED