LED环氧树脂封装的光学设计与模拟.pdfVIP

( ) 31 10 V ol. 31 No. 10 200 8 10 JOU RN AL OF H EFEI UN IV ERSITY OF TE CH N OL OGY Oct . 2008 LED 1 1 2 , , ( 1. , 230009 2. , 325035) : LED , , LED , LED , LED , LED : : T N202 : A : 100325060( 2008) 102 16952 04 Design and simulat ion of LED epoxy r esin packages 1 1 2 ZH ANG J ian , YA NG Min g2wu , H U Zh i2wen ( 1. Dept . of Appli ed Ph ysics, H efei Univer sit y of Technol ogy, H efei 230009, China 2. School of Comput er Sci ence and Engineerin g, W en zhou Univer sit y, Wen zhou 325035, Ch ina) Abstr act : An ex cellent design of ep oxy resin str ucture is v ery imp ort ant t o improve t h e LED device op2 t ical perform an ce an d redu ce t h e experiment cost . Th e design ing an d simu lat in g of LED pack ages are complet ed b ased on t h e non2sequ en ce ray trackin g t h eory. Some cor relat ive paramet ers of t h e ep oxy resin st ruct ure and mat erial are ch an ged an d an alyzed so as t o obtain th e regu lar it y of t h e inten sit y dis2 t ribution . Th e simu lat ed resu lts will prov ide some u sefu l referren ce for LED p ack aging comput er2ai2 ded design . Key word s: light emit t in g diode( LED) ep oxy resin pack age r ay t rack ing computer2aided design simu lat ion ( Light Emit tin g Diode, , LED) LED [ 6] , LED 100% , LED , , [ 1- 5] ,