chemical_unlayering.pdfVIP

st 21 Century Product Analysis Chemical Unlayering-1 13 Chemical and Mechanical Deprocessing ..................................................2 13.1 Wet Chemical Etching..........................................................................2 13.1.1 Silicon Etch Chemistry ...................................................................2 13.1.2 Dielectric Removal ......................................................................... 3 13.1.3 Decoration Etches/Stains ................................................................ 5 13.1.4 Metal Interconnect and Polysilicon Etches...................................... 6 13.1.5 Gallium Arsenide Etch Chemistry .................................................. 7 13.2 Reactive Ion Etches .............................................................................. 7 13.2.1Nitride.............................................................................................. 10 13.2.2 Silicon Dioxide Etches ................................................................. 10 13.2.1 Metal Etches................................................................................. 11 13.3 Parallel Lapping ................................................................................. 11 13.4 Die Backside Polishing ...................................................................... 12 13.5 References ......................................................................................... 13 ?2002, Semitracks, Inc. st Chemical Unlayering-13 21 Century Product Analysis 13 Chemical and Mechanical Deprocessing Once a failure site has been localized to a particular x-y location, it is often necessary to expose the defect to examine it more closely. This is accomplished through either chemical deprocessing, mechanical deprocessing, or a combination of both. Chemical deprocessing is both an art and a science, which requires both knowledge of the part being analyzed and some basic chem