《03 Application of Molecular Dynamics Simulation in Electronic Packaging》.pdf

Chapter 3 Application of Molecular Dynamics Simulation in Electronic Packaging Haibo Fan(*ü ) and Matthew M.F. Yuen 3.1 Introduction With the increasing need for high input/output (I/O) counts and miniaturization, novel electronic packages are continuously being developed. Chip scale packages are beginning to replace older leadframe technology because of low cost, size, and performance advantages. Wafer-level packaging technology is becoming popular due to low cost and higher electronic performance. At same time, more and more functional materials at the nanoscale are used in electronic packaging for the improvement of the adhesion and thermal conductivity, such as carbon nanotube (CNT), thermal interface material (TIM), and self-assembly monolayer (SAM). To obtain good performance of these materials and guide the experimental research, it is important for us to find methods to understand material behavior at a fundamen- tal level. Obviously, a traditional method like finite element analysis widely used in electronic packages is not suitable for modeling the behavior of these materials at a nanoscale level. Molecular dynamics (MD) simulation is now one of the fastest growing research areas and can reproduce material behavior at atomic level. Therefore, investigation of material behavior using MD simulation in electronic packaging is both necessary and attractive. 3.2 Molecular Dynamics Simulation Molecular modeling is the science of representing molecular structures numerically and simulating their behavior with the equations of quantum and classical physics