mems真空封关键技术研究.pdfVIP

摘 要 目前，MEMS 芯片的设计与制造技术已经相当成熟，但是，由于MEMS 封装技 术的研究明显滞后，使许多MEMS 芯片没有得到实际应用，限制了MEMS 的发展。 在MEMS 封装技术中，MEMS 真空封装是一个需要重点研究的课题，因为大多数的 MEMS 器件都需要真空封装，这些器件内部都具有可动部件或者真空腔体，只有采用 真空封装，才能获得较好的性能。而现在国内外的真空封装技术还很不成熟，存在成 本高、可靠性不好等问题。因此，本文在真空封装的理论、设备及工艺等方面作了一 些探讨，具体内容及创新点如下： 首先，应用真空物理相关理论,分析了封装腔体的真空度与气体吸附和脱附、气体 通过小孔的流动之间的关系；探讨了器件级与圆片级真空封装的基本工艺原理。 然后，自主研制了一种MEMS 真空封装工艺设备，该设备具有抽取真空、加热及 温度控制、冷却、对准及力加载等功能，可以满足若干真空封装关键工艺的需求。 其次，从理论上分析了真空度对MEMS 器件品质因数的影响，以及对微陀螺仪进 行真空封装的必要性；在自制的真空封装设备上进行了真空封帽的试验研究，摸索出 了在自制的真空封装机上进行真空封帽的最优的工艺参数；在该工艺参数下，成功的 完成了微陀螺仪的真空封帽。 最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素， 提出了较为可行的键合工艺。 关键词： MEMS 真空封装 真空封帽 阳极键合 金-硅键合 I Abstract Athough the design and fabricating of the MEMS chips have already been well developed,the application of these chips is not full spread because of the lag of the MEMS packaging technology.Among the MEMS packaging technology,the vacuum packaging is an important technology needed to be investigated in no time for the needs of most MEMS devices which had locomotory parts or vacuum cavities. Only after vacuum packaging,these devices could achieve good performances.However,the vacuum packaging technology both at home and abroad is not proved to be effective and still remains some problems such as high cost,lack of reliability and so on.Therefore,this thesis makes some research on the theory,equipment and technology of the vacuum packaging.The detail and innovative work presented in this thesis are summarized as fellows: Firstly how the desorption of the gas absorbed by the packaging materials and the leakage of the gas through the micro holes affect the vacuum in the packaged cavities is analized by applying the related vacuum physics theories.and researches are made on the te