Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC testing probe cards》.pdfVIP

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Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC testing probe cards》.pdf

Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC testing probe cards》.pdf

Microelectronic Engineering 86 (2009) 2211–2216 Contents lists available at ScienceDirect Microelectronic Engineering journal homepage: www.else /locate/mee Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC testing probe cards Fei Wang, Xinxin Li *, Rong Cheng, Kewei Jiang, Songlin Feng State Key Laboratory of Trans

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