Study on low-Ag content Sn–Ag–ZnCu solder joints》.pdfVIP

Microelectronics Reliability 53 (2013) 2018–2029 Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: /lo cate/microrel Study on low-Ag content Sn–Ag–Zn/Cu solder joints Tingbi Luo a, Zhuo Chen a, Anmin Hu a,⇑, Ming Li a, Peng Li b a State Key Laboratory of Metal Matrix Composites, Institute of Micro-Electronic Materials and T