《PEC电子工程英语证书考试-半导体词汇汇总》.doc

PEC电子工程英语证书考试-半导体词汇汇总 1号极限开关 LS1(limit suitch 1) 232 bus的使用寿命已到或线路短路或断路 232 bus error 488 bus的使用寿命已到或线路短路或断路 488bus error 5S(整理、整顿、清扫、清洁、修养) 5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke) 5u之pp质滤心 cartridge p.p 5u ABC分类法 ABC classification AUTO模 automatic molding system A板 A plate BT指示剂 eriochrome black t indicator B板 B plate CO2气泡机 CO2 bubbler DIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收 Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable. DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。 The product is rejectable when pad support protrudes more than 0.25mm from the end of the package body.(sop:0.15mm). DIP：不符合脚量规之脚弯拒收。 Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable. DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或大脚以上厚度大于0.75mm，拒收。 Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide below the seating plate, or an overall thickness of 0.75mm above the seating plane is rejectable. DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。 Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead. DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。 Ejector marks more than above the surface or more than 0.5mm below the surface of the device is rejectable. DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。 Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body. DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm直径圆面积之沾污。 Package leads shall be free from attached foreign material except for foreign material located above the seating plane of the lead, not bigger than 0.15mm in diameter. DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒收。 Any lead with dam bar step dimensions exceeding 0.25mm is rejectable. Driver board的使用寿命已到或线路短路或断路 driver board error EDTA-2NA 标准溶液 EDTA-2NA standard solution Eprom的使用寿命已到或线路短路或断路 eprom error KBS 94 混床树脂筒 leasing mix bed resin bottle, kbs 94 L/F存放架 stack loader L/F放反将导致反弯脚。 Lead frame reverse will cause reverse bending. L/F排放机 Lead Frame A