simulationandexperimentalanalysisofabrasive-OeTG.PDFVIP

SIMULATION AND EXPERIMENTAL ANALYSIS OF ABRASIVE WEAR IN ULTRA HIGH-SPEED GRINDING J. SHIMIZU, L. ZHOU, A. MUROYA and H. EDA Ibaraki University, 4-12-1 Nakanarusawa, Hitachi 316-8511, JAPAN; e-mail: jshimizu@dse.ibaraki.ac.jp SUMMARY This study aims to reduce the work-affected layer of the machined surface by carrying out the grinding at the speed over static propagation speed of plastic wave of ductile materials by applying the minute cutting depth to prevent crack generation and obtain high-quality surface in the high productivity, and also aims to clarify such an ultra high-speed machining mechanism. This paper reports on the result obtained through the molecular dynamics simulations on the abrasive wear process in ultra high-speed grinding of aluminium by a diamond abrasive. Several grinding experiments below and beyond static propagation speed of plastic wave have also been conducted on the material same as used in the simulations and some comparisons have been carried out, as well. From the simulation results, it is verified that the plastic deformation is reduced when the machining speed exceeds the material static propagation speed of plastic wave and its mechanism is completely different from that of the ordinary grinding process. Experimental results also show the improvement of the surface integrity when the machining speed exceeds the material static propagation speed of plastic wave. Keywords: molecular dynamics, abrasive wear, grinding, propagation speed of plastic wave, work-affected layer 1 INTRODUCTION have also been conducted on the same material as used in the simulations and some comparisons have been Practical applications of ultra high-speed grinding have carried out, as well. been