《电子封装用陶瓷基片材料的研究进展》.pdfVIP

# 16 # 材料导报 2008 年11 月第22 卷第11 期 * 张兆生, 卢振亚, 陈志武 ( , 510640) 简要介绍了电子封装发展情况及其对基片材料的性 要求, 分析了陶瓷基片作为封装材料性 上的优 点,概述了几种常用陶瓷基片材料的优缺点及其应用:Al O 作为传统的陶瓷基片材料, 优点是成熟的工艺和低廉的 2 3 价格, 但热导率不高; BeOBNSiC 等都具有高热导率, 在某些封装场合是合适的选择; AlN 综合性 最好, 是最有希 望的电子封装陶瓷基片材料介绍了多层陶瓷基片材料的共烧技术和流延成型技术, 并指出LT CC 技术和水基流延 将是未来发展的重点 Research Progress in Ceramic Substrate Material for Electronic Packaging ZHANG Zhaoshe g, LU Zhe ya, CHEN Zhiwu ( College of Materials Scie ce a d E gi eeri g, South Chi a U iversity of Tech ology , Gua gzhou 510640) Abstract The developme t of electro ic packagi g a d its eleme tal requireme t for electro ic packagi g sub- strate materials are briefly reviewed i this paper .T he adva tages of ceramic substrate material are a alyzed. The ad- va tages, disadva tages a d applicatio of some commo ceramic substrat es are summarized: mature process a d cost- effective ess are the tw o adva tages of Al O ceramic as traditio al ceramic subst rate, but the thermal co ductivity is 2 3 ot high e ough; the thermal co ductivities of BeO, BN, SiC are high, a d they are suitable choice to be used i some packagi g field; AlN has the best comprehe sive properties a d it is the most promisi g electro ic packagi g ceramic material. Co- firi g a d tape-cast i g tech ology i fabricati g multilayer ceramic substrates are discussed. LT CC a d aqueous tape casti g tech ology will be the most promisi g tech ologies. Key words electro ic packagi g, ceramic substrat e, co-firi g, tape-casti g 0 : ,