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* * D. C. Plasma Spray Forming of Nanostructured Composite Coatings Objectives 1. To Agglomerate Nanocrystalline Powder for Thermal Spray 2. To Reduce the Brittleness of Conventional Microstructured Ceramic Coatings for Improving the Durability of Gas Turbine Engines Agglomeration Process Ball Milling?Slurry Preparation? Ultrasonic Dispersing?Spray Drying? Heat Treatment Nanocrystalline Al2O3 or TiO2 Powder before Agglomeration SEM Micrograph of Nanocrystalline Powder at a High Magnification SEM Micrograph of Agglomerated Al2O3/TiO2/SiO2 Nanocrystalline Powder Surface Morphology of One Agglomerated Al2O3/TiO2/SiO2 Particle Nanocrystalline Particles on the Surface of One Large Agglomerate Conditions for Plasma Spray Forming of Nanostructured Coatings Process Vari-ables Plasma Current (A) Plasma Voltage (V) Primary Gas Flow (l/min) Carrier Gas Flow (l/min) Powder Feed Rate (g/min) Particle size (?m) Spray Dist-ance (mm) Ranges 400-650 60-75 40-100 20-40 2-45 10-100 80-120 ? Critical Plasma Spray Parameter is defined as CPSP=(Plasma Current * Plasma Voltage)/Primary Gas Flow Rate Cross Sections of the Particles of Starting Powders as Plasma Spray Feedstock Commercial Metco 130 Al2O3/TiO2 Powder Agglomerated Nanocrystalline Al2O3/TiO2 Powder X-Ray Diffraction Patterns of Nanocrystalline Al2O3/TiO2 Powder and Commercial Metco 130 Powder Cross Section of Plasma Spray-Formed Coating Fraction of Unmelted Particles vs CPSP or Plasma Temperature Coating Porosity vs CPSP or Plasma Temperature Diagrams of Bend Test and Cup Test Facilities Bend Test Results Conventional Microstructured Coating Nanostructured Coating Modified Nanostructured Coating Cup Test Results Microstructured Coating Nanostructured Coating Crack Growth Resistance/Toughness vs CPSP or Plasma Temperature Model of Nanostructured Coating (upper), Nanostructured-Microstructured Composite Coating (center), and Conventional Microstructured