ABS装饰性电镀应用培训资料资料.ppt

* Filtration recommended using 3 micron cotton or Dynel wound polypropylene lined filter tubes or equivalent. * * The tin / palladium colloid is absorbed into the chemically active sites produced at the surface of the plastic after etching. Filtration required using 10-20 micron cotton or Dynel wound polypropylene lined filter tubes or equivalent. Less than 10 micron filtration will remove tin/palladium colloid. * * * Udique? 887 DT Accelerator is a fluoride based process, therefore, titanium heating coils cannot be used. Heating coils must be of Teflon spaghetti design. Teflon coated titanium heating coils usually get destroyed at some point due to pin-holes in the Teflon coating or gouges created during installation or use. * Filtration required using 5-10 micron cotton or Dynel wound polypropylene lined filter tubes or equivalent. Filtration rate of 1 to 2 turnovers per hour. Excessive solution movement can contribute to skip-plating. Return flow of the filtered EN solution to the plating bath must be properly directed and controlled to eliminated plating rejects due to either excessive or inadequate solution movement. UDIQUE? 891/894 contain the same amount of metallic stabilizer UDIQUE? 543 can be used to supplement the metallic stabilizer UDIQUE? 893 can be used to supplement the chelators * Low UDIQUE? 892 concentrations will cause a slow plating rate, slow initiation rate, and/or promote skip plate. High UDIQUE? 892 concentrations will increase plating rate, initiation rate and phosphorous content in the deposit * Low concentration will increase contact burn-off, initiation rate and plating rate Will promote nickel dissolution/attack in the copper strike May cause gas pitting High concentration will slow initiation rate and plating rate Low metal thickness Will contribute to skip-plating Will promote nickel dissolution/attack in the copper strike * * * * * 8ml 63 8ml 61D 2ml * * 镍封 – DUR NI 618 DN 618固体 提供镀液中的固体，令镀层产生微孔 添加前必须搅拌，降低固体体积，令固体均匀分