CSPDESIGNRULE-CUSTOMER-REV.L.PPT.pptVIP

Best Bad 9. distance between Inner finger and adjacent wire 1 wire diameter (Min). (內手指的兩側與相鄰長線之距離必須 1 倍線徑) Wire angle of inner finger (內手指線之角度) 10. For Fine pitch product (BPP=60um), the shorter wire of the front finger angle (Non-include the Power/Ground Ring) must equal or less than the calculated value from the formula which W/B project team provided. ( 針對Fine Pitch產品(BPP=60um), 前手指線(不含Power/Ground Ring)其最小 角度必須依W/B專案組所提供之公式計算出。) Inner pad wires cross outer pad wires rules (內鋁墊線需跨外鋁墊線之規則) 11. If C is small than 800um, the cross point must be smaller than half of inner pad wire length. ( 當前後手指Pitch小於800um時，交叉點必須小於內層鋁墊金線的一半。) 12. If C is larger or equal to 800um, the cross point can be larger than half of inner pad wire length. ( 當前後手指Pitch大於等於800um時，此時交叉點可以大於等於內層鋁墊金線 一半。) A B C A B C 7. If C 800um, B A/2 8. If C = 800um, B can be A/2 Note: Don’t let wires cross each other as possible as you can, even the wires are in different pad level. (即使是不同鋁墊層的線，也儘可能不要讓線彼此交錯。) 3. Device Design Rule Pad Size Layout PAD Size Device Size A * ASE ASEK CSP-BGA (Sawing Type) Substrate Design Rev. :L Date : 04/13/04” Prepared : Damon_Hung Content ? Necessary Data Of Substrate Design ? Substrate Structure ? Ring / Finger Placement S/M Design Rule ? Finger Design Rule ?Bonding finger width, wire quantity and wire diameter design rule ? Outer Layer Trace Design Rule Finished Value ? Inner Layer Trace Design Rule Finished Value ? Via Design Rule ? Dimension of Solder Ball and Pad/SM Opening ? Laminate Blind Via Design ? Package type ? Body size ? Substrate layer number ? Bond pad number of ground / power / signal ? Staggered or inline pad design ? Actual die size or estimated min./max. die size ? Solder ball number, location and pitch ? Assigned ground/power ring number or segment location ? Bond finger number for each side of package ? Net list (pad no., net