等离子技术-培训技巧.ppt

等离子技术讲座: 等离子原理及其应用 PLASMA TRAINING PROGRAM ; 目录 Agenda;等离子技术在高级封装工业的应用 Plasma Application in Advanced Packaging Industries ;综述 Overview:;集成电路封装面临的挑战IC Assembly and Packaging: Specific Challenges;等离子体应用Plasma Applications;表面活化: 芯片粘结Surface Activation: Die Attach;污染物去除: 导线连接Contamination Removal: Wire Bonding;污染物去除: 导线连接Contamination Removal: Wire Bonding;污染物去除和表面活化: 封装Contamination Removal and Surface Activation: Encapsulation;Delamination Biggest Challenge For Organic Based Substrates Laminate Materials Absorb Water From Air and the Flux Residue Removal Process Trapped Moisture Released From High Temperatures: Use or Soldering Oxidation on Metal Leadframes Can Inhibit Adhesion of Frame to Mold Plasma Treatment of BGA Packages, Other Polymer Substrates, and Metal Leadframes Improves Surface Activity Achieves Good Adhesion Minimizes Delamination;表面活化: 填料Surface Activation: Underfill;Presence of Oxides Inhibits Wire Bonding Limits Good Die Attachment Inhibits Solder Reflow Plasma Treatment Reduces Metal Oxides Improves Wire Bond Strength Improves Die Attachment Improves Solder Reflow ;印刷线路板上的残余物清除Desmearing in PCB;集成电路封装中等离子工艺的应用IC Assembly and Packaging: Plasma Solutions;等离子工艺的其它应用Other Plasma Applications;关键参数Critical Product Parameters;等离子工艺参数Parameters For Plasma Processing;;等离子技术 Plasma Technology;等离子体简述 Plasma: What, Why, How;什么是等离子体What is a Plasma?;固态 ? 液态 ? 气态 ? 等离子态 Solid ? Liquid ? Gas ? Plasma Energy Energy Energy;等离子体的组成Components of a Plasma;等离子体特性Plasma Properties;表面反应机理: 物理反应Surface Reaction Mechanisms: Physical;表面反应机理: 化学反应Surface Reaction Mechanisms: Chemical;表面反应总结Summary of Surface Reaction Mechanisms;等离子技术的优点Advantages of Plasma Treatment;等离子工艺Plasma Process;等离子体的产生Generating a Plasma;等离子体的产生Generating a Plasma;等离子体的产生Generating a Plasma;等离子体的重要特性Important Properties of a Plasma;等离子体的电子和离子特性Plasma Electron and I