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课程设计用纸
第 页
目 录
引言···································································1
1.1作品简介······························································1
1.1.1作品的现实意义···················································1
1.1.2作品最终实现的功能···············································1
1.2作品设计思路及方案····················································1
1.2.1基本设计思路·····················································1
1.2.2作品设计方案论证·························??·······················2
1.3知识点应用····························································3
2. 硬件设计·····························································4
2.1硬件设计思路··························································4
2.2各个模块设计说明······················································4
2.2.1AT89C51芯片简介··················································4
2.2.2单片机最小系统···················································4
2.2.3DS18B20温度采集模块··············································5
2.2.4数码管显示模块···················································7
2.2.5独立按键设置模快·················································8
2.2.6报警模块·························································8
2.3整体的硬件设计原理图··················································9
3. 软件设计····························································10
3.1软件设计思路·························································10
3.2主程序设计···························································11
3.3核心子程序设计·······················································12
3.3.1DS18B20初始化···················································12
3.3.2读取温度数据子程序··············································12
3.3.3按键扫描子程序··················································13
4. 作品调试与分析·····················································14
4.1问题与解决方法·······················································14
4.2最终实物效果图······················································16
5.结语·········
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