PCBA外观检验规范02学习资料.pptVIP

放松游戏 测智商 谢谢 理想狀況(TARGET CONDITION) DIP2-9 零件組裝標準--機構零件﹝JUMPER PINS﹞組裝性(次缺Minor) 允收狀況(ACCEPTABLE CONDITION) DIP 外 觀 檢 驗 規 範 PAGE 9 1. PIN排列直立 2. 無PIN歪與變形不良。 1.Pin is straight. 2.Pin surface is luminous and no bur is appeared. 1. PIN( 撞 )歪小於1/2 PIN的厚 度，判定允收。 2. PIN高低誤差小於0.5mm內 判定允收。 1.Dimension P is less than ? thickness of pin. 2.Dimension H is less than 0.5mm. 1. PIN( 撞 )歪大於 1/2 PIN的厚 度，判定拒收。 2. PIN高低誤差大於0.5mm外， 判定拒收。 1.Dimension P is greater than ? thickness of pin. 2.Dimension H is greater than 0.5mm. PIN高低誤差 (H) ≦ 0.5mm PIN歪(P) ≦1/2 PIN厚度 拒收狀況(NONCONFORMING DEFECT) PIN高低誤差(H) 0.5mm PIN歪(P)1/2 PIN厚度 P H H P PCB DIP2-10 零件組裝標準--機構零件﹝JUMPER PINS﹞組裝外觀(次缺-Minor) 允收狀況(ACCEPTABLE CONDITION) 拒收狀況(NONCONFORMING DEFECT) PIN有毛邊、缺邊表層電鍍不良等現象 PIN變形、上端 成蕈狀不良現象 DIP 外 觀 檢 驗 規 範 PAGE 10 1. PIN排列直立無扭轉、扭曲不 良現象。 2. PIN表面光亮電鍍良好、無毛 邊扭曲不良現象。 1.Pin is straight. 2.Pin surface is luminous and no bur is appeared. 1. 連接區域PIN有毛邊、表層電 鍍不良現象，判定拒收。 2. PIN變形、上端成蕈狀不良現 象，判定拒收。 1.There is bur or poor plating phenomenon on pin surface. 2.Pin is deformed or bent. PCB 理想狀況(TARGET CONDITION) DIP2-12 零件組裝標準K/B JACK 、POWER 零件浮件與傾斜(次缺Minor) 允收狀況(ACCEPTABLE CONDITION) 浮高.傾斜 Lh .Wh≦0.5 mm 拒收狀況(NONCONFORMING DEFECT) DIP 外 觀 檢 驗 規 範 PAGE 12 POWER CONN POWER CONN 浮高.傾斜 Lh .Wh 0.5 mm POWER CONN K/B JACK K/B JACK K/B JACK 1. K/B JACK與POWER SET 平 貼於PCB零件面。 Component is mounted on M/B closely. 1. 浮高、傾斜小於0.5mm內， 判定允收。( Lh,Wh≦0.5mm ) 2.錫面零件腳出孔判定允收 LH is less than 0.5mm and lead is protruded over solder. 1. 浮高、傾斜大於0.5mm，判定 拒收。( Lh,Wh0.5mm) 2. 錫面零件腳未出孔判定拒收。 1.LH is greater than 0.5mm. 2.Lead is not protruded over solder. 拒收狀況(NONCONFORMING DEFECT) DIP2-13 零件組裝標準-- 零件腳折腳、未入孔、未出孔(主缺Major) 允收狀況(ACCEPTABLE CONDITION) DIP 外 觀 檢 驗 規 範 PAGE 13 1.零件腳未入孔，判定拒收。 lead does not be inserted into hole. 拒收狀況(NONCONFORMING DEFECT) 1.零件腳折腳、零件腳未出孔， 判定拒收。 Bent pin or lead does not be inserted into ho