A Study on Microstructure and Reliability Tests of Low Cost Flip Chip.docVIP

A Study on Microstructure and Reliability Tests of Low Cost Flip Chip  Jian Cai1*, Annette Teng1, Philip C. H. Chan2, Simon P. C. Law2, Guowei Xiao2 1 Computer Aided Design Manufacturing Facility 2 Department of Electrical and Electronic Engineering Hong Kong University of Science and Technology Hong Kong SAR, China *Email: jamescai@ Abstract Electroless nickel plating followed by stencil printing is an attractive process because of its cost savings over the conventional high lead C4 process. The development of the process for reliability of this low cost bumping process at HKUST is di