《机电一体化毕业设计(论文)_统冻结站温度与压力测量系统》.doc

南京工业大学继续教育学院 毕 业 设 计 题 目：统冻结站温度与压力测量系 学生姓名 学 号 专 业 机电一体化（专科） 班 级 2007级 指导教师 校外站点 徐州分院 2008 年 11月 摘 要 本设计就是基于AVR单片机设计的温度与压力监测系统。采用DS1722最多可以采集8路温度数据。通过小键盘实现对不同路温度数据的切换显示。同时，也可利用小键盘实现温度与压力最大最小值的设定。对于超过此限的温度与压力数据将产生报警信号 单片机是电子测量领域常用的测量核心元件之一，也是电子工程人员最为熟悉的电子器件，主要用来计算和控制采集的信号，在科学研究，科学实验以及现场测量等许多领域被广泛应用。 关键词：冻结站;温度;压力;单片机;传感器 目 录 1 概述·····························································1 1.1 研究目的及意义··················································1 1.2 国内外研究现状··················································1 2 冻结站工作原理···················································3 3 监测系统总体组成设计·············································5 3.1 系统硬件组成····················································5 3.1.1 控制元件单片机················································5 3.1.2 传感器选择····················································7 3.1.3 温度测量元件DS1772···········································9 3.1.4 压力测量元件PT124···········································10 4 冻结站监测系统硬件设计··········································13 4.1 系统设计要求···················································13 4.2 系统设计方案···················································13 4.3 硬件电路设计···················································14 4.3.1 电源电路模块··················································15 4.3.2 键盘接口电路模块··············································16 4.3.3 模-数转换电路·················································17 结论······························································19 参考文献··························································20 致谢······························································22 1概述 1.1研究目的及意义 在工业生产中，温度、压力都是常用的主要被控参数。其中，温度控制也越来越重要。在很多领域中，人们都需要对各类加热炉、热处理炉、反应炉和锅炉中的温度进行检测和控制。采用单片机对温度进行控制不仅具有控制方便、简单和灵活性大等优点，而且可以大幅度提高被控温度的技术指标，从而能够大大的提高产品的质量和数量。因此，单片机对温度的控制问题是一个工业生产中经常会遇到的控制问题。? 设计侧重介绍“单片机温度控制系统”的软件设计及相关内容。设计的主要内容包括：采样、滤波、键盘、LED显示和报警系统，单片机AVR的