半导体材料用与研究.pptVIP

Technology Road Map By: Wen-Jen Liu Date: 04/30/2001 page: * Photo: Raw material : Reticle, Photo Resist Equipment : I-Line(MUV), DUV, EUV (Stepper, SCANNER) Vendors: Nikon, ASML 2. Module definition - PHOTO The PHOTO concept was general Optics lithography to reproduce the specific patterns. Today we deployed the UV Excimer laser for the light, According to Optics principle, generally the wavelength of the light should be less than one tenth of half pitch, so if the technology shrink, the Exposure light source should be pushed into deeply UV zone. 唆蔷脚距靡亿宗融峭椿湾毯搂淀绣裂牢置墙隘括妆扩翻北肘渝名毒夜涸诣半导体材料用与研究半导体材料用与研究 Thin-Film: Raw material : Metal Target, Chemical Equipment : Sputter, RTP, CVD (AP, PE, LP, SP, MO), Scubber Vendors: AMAT, Novellus, TEL, ASM….. 2. Module definition - Thin Film In general we can split the Thin-Film into two field, one is Physics dominated (PVD), the other is Chemical dominated (CVD) The PVD means that no chemical reaction assisted in the process, just simply accelerated Ar atom to bombard the target to evaporate the target and deposit on the wafer, such likes Sputter. The CVD means that the chemical reaction on the wafer or chamber to deposit a film on the surface CVD PVD Chemical reaction 沉费史奔蔓舆鸵衣誉屋捂舍啊饭羚羽付厂脏蚂滇棍翼篙孪竟系奥滔倪遍雁半导体材料用与研究半导体材料用与研究 Etch Raw material : Solvent, Reactive gas Equipment : Dry Etch (RIE), Wet Bench (Chemical Station) Vendors: AMAT, Novellus, TEL, ASM….. 2. Module definition - ETCH In general we can call that RIE in the term of Dry etching, the dry etching which dominated by the Physical Ion bombard and chemical reaction with the surface to evaporated the byproducts. Reactive ion bombard 玻卵岭碌披抹勉巡显轩枯猖规酒峨温岩翌俱高悲添眺隐士酉瞩既炙会力茬半导体材料用与研究半导体材料用与研究 Diffusion Raw material : Chemical Gas, Isotope gas Equipment : Implanter , Furnace Vendors: Eaton, Varian, KE, TEL... 2. Module definition - Diffusion In the diffusion, there’re two methods to deliver the dopant into the silicon wafer : . Implant : To accelerate the isotope and direct bom