Gdaydfmchecklist.pptVIP

前言: Redundancy Cleanup Redundant Line Removal Redundant Line Removal NFP Removal NFP Removal Drawn to Outline Drawn to Outline Repair Pad Snapping Pad Snapping Pinhole Elimination Pinhole Elimination Neck Down Repair Neck Down Repair Neck Down Repair Neck Down Repair Sliver Sliver Acute Angles Sliver Acute Angles Sliver Acute Angles Sliver Peelable Repair Sliver Peelable Repair Classic Sliver Fill Tangency Elimination Legend Sliver Fill Optimization Signal Layer Opt. Signal Layer Opt. Signal Layer Opt. Signal Layer Opt. Solder Mask Opt. Solder Mask Opt. Solder Mask Opt. Solder Mask Opt. Line Width Opt. Line Width Opt. Line Width Opt. Silk Screen Opt. Silk Screen Opt. Silk Screen Opt. Power/Ground Opt. Power/Ground Opt. Power/Ground Opt. Power/Ground Opt. Yield Improvement Teardrops Creation Teardrops Creation Copper Balancing Copper Balancing Etch Compensate Etch Compensate Etch Compensate Etch Compensate Advanced Construct Pads(Auto.,All Angles) Construct Pads(Auto.,All Angles) Apply to: 對所有資料或指定部份執行 Minimum Maximum: 自動建構的Pad尺寸範圍。 Tolerance: 公差 Reference SM: 參考的防焊層 Standard Symbols Allowed: 允許建構的symbol Construct Pads(Auto.,All Angles) Construct Pads(Auto.,All Angles) Constructed Pad: 成功的建構成Pad Hammer Head Etch Compensation 簡介 1. 針對軟板、BGA、Lead_Frame之SMD處做蝕刻補償 2. 解決過蝕現象 3. Compensated SMD: SMD與補償為一體，Pad。 Corner Feature: SMD本體不變，補償為Surface. 4. 可選擇補償形狀 Hammer Head Etch Compensation Hammer Head Etch Compensation Apply To:對所有資料或指定部份補償 Compensate By: 補償的方式 Corner Shape:補償的形狀:尖角Fillet或球狀Ball Size Determined By: 尺寸決定方式 有百分比Percentage與自訂數值Value二種 Cu. Spacing: 與鄰近資料的間距 Sliver Spacing: 為避免產生細絲的距離 Maintain Cu. Spacing By: 有二種保持間距的做法 Removing Corner: 不補償該角落 Reducing Size: 縮小尺寸 Hammer Head Etch Compensation 屬性 (Attribute) .etch_comp_addition 執行後之報告(Category): 1. Fully Compensated: 完全補償成功 2. Removed Corners: 因間距不足而不補償之角落 3. Size Reduced: 因間距不足而縮小尺寸之角落 4. Uncompensated: 完全無法補償之SMD BGA Tie Line Generation BGA Tie Line