Steps to LeadfreeWave Only.pptVIP

Step 1: Select the right materials and equipment 1.2 Alloy selection How to select alloys? 1.3 Flux selection ( Wave ) 1.3 Flux selection (paste) * 1.1 Material selection From alloy and flux selection to necessary equipment capabilities. 1.2 Alloy selection Which alloy? How to select? Alloy selection Research consortia Product Melting points Availability Thermal mechanical properties Wetting balance tests Price Companies lead free experiences 1.2 Alloy selection 1.3 Flux selection Environmental issues  (minimize VOC emission, halogen free). Higher temperatures  (± 130 degr.C on topside board). Clean or no clean process. Activity (nitrogen on solder wave?) Selection criteria for reflow soldering: VOC free Activity (Nitrogen oven?) Temperature profile Tackiness 1.3 Flux selection 1.4 Board selection Board material selection: Halogen free (legislation) Higher temperatures: Delamination  Warpage 1.4a Board selection: Packaging material 1.4 Board selection 1.4b Board selection: board finish Cu OSP (typical hole filling) 1.5 Component selection 1.5a Component selection: packaging material Mold compounds and substrates halogen free. New plastics need to be designed to meet the  higher temperature requirements. Lead-free die and passive attachments (NiPd) Lead-free solderballs (area array packaging) 1.5 Component selection 1.5b Component selection: Solder finish 1.6 Check compatibility 1.6 Check compatibility Selected materials should not be in conflict with: Legislation (for example WEEE, EPA) Selected materials should be able to meet requirements: Thermal requirements (profile) Metallurgical requirements Specifications (application specific) Acceptable price 1.7 Machine requirements The next steps will determine the machine configuration. 1.7 Machine requirements 1.8 Conveyor A proper board support will prevent the board from warping. 1.8 Conveyor (wave) Lead-free process: Higher preheat temperatures Longer contact times Higher sold