微组装技术﹕mptmicroelectronicpackagingechnology.docVIP

微組裝技術﹕MPT/Microelectronic Packaging echnology ? 混裝技術﹕Mixed Component Mounting Technology ? 封裝﹕??? Package ? 貼片﹕?? Pick and Place ? 拆焊﹕? Desoldering ? 再流﹕Reflow ? 浸焊﹕ Dip Soldering ? 拖焊﹕ Drag soldering ? 印制電路﹕Printed? Circuit ? 印制線路﹕ Printed Wiring ? 印制電路板﹕ printed circuit board ? 印制線路板﹕printed wiring board ? 層壓板﹕laminate ? 覆銅薄層壓板﹕copper-clad laminate ? 基材﹕base material ? 成品板﹕production board ? 印刷﹕printing ? 導電圖形﹕conductive pattern ? 印制元件﹕printed component ? 單面印制板﹕single-sided printed board ? 雙面印制板﹕double-sided printed board ? 多層印制板﹕multilayer printed board ? 電烙鐵﹕? Iron ? ?潢摲牥∽0?? ??
熱風嘴﹕ hot air reflowing noozle ? 吸錫帶﹕soldering? wick ? 吸錫器﹕tin extractor ? 焊後檢驗﹕post-soldering inspection ? 目視檢驗﹕visual? inspection ? 機器檢驗﹕ machine inspection ? 焊點質量﹕ soldering joint quality ? 焊電缺陷﹕ soldering jont defect 錯焊﹕ solder wrong ? 漏焊﹕ solder skips ? 虛焊﹕ pseudo soldering ? 冷焊﹕ cold? soldering ? 橋焊﹕ solder bridge ? 脫焊﹕ open soldering ? 焊點剝離﹕ solder off ? 不潤濕焊點﹕ soldering nonwetting ? 錫珠﹕ solder ball ? 拉尖﹕ icicle ； solder projection ? 孔洞﹕ void ? 焊料爬越﹕ solder wicking ? 過熱焊點﹕ overheated solder connection ? 不飽和焊點﹕ insufficient solder connection ? 過量焊點﹕ excess solder connection ? 助焊劑剩余﹕ flux residue ? 焊料裂紋﹕ solder? crazeing ? 焊角翹起﹕ fillet-lifting ；lift-off ? ? AI :Auto-Insertion 自動插件 AQL :acceptable quality level 允收水準 ATE :automatic test equipment 自動測試 ATM :atmosphere 氣壓 BGA :ball grid array 球形矩陣 CCD :charge coupled device 監視連接元件(攝影機) CLCC :Ceramic leadless chip carrier 陶瓷引腳載具 COB :chip-on-board 晶片直接貼附在電路板上 cps :centipoises(黏度單位) 百分之一 CSB :chip scale ball grid array 晶片尺寸BGA CSP :chip scale package 晶片尺寸構裝 CTE :coefficient of ther?潢摲牥∽0?? ??
mal expansion 熱膨脹系數 DIP :dual in-line package 雙內線包裝(泛指手插元件) FPT :fine pitch technology 微間距技術 FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC :integrate circuit 積體電路 IR :infra-red 紅外線 Kpa :kilopascals(壓力單位) LCC :leadless chip carrier 引腳式晶片承載器 MCM :multi-chip module 多層晶片模組 MELF :metal electrode face 二極體 MQFP :metalize