DA DOE report.ppt

Background Infineon feedback over fillet height issue for the shipping qualification lot, it is assumed that epoxy volume control is not very good at the set up stage. Key Word Bond Force, Bond Height, Dispense Pressure, Capillary Diameter Purpose To verify the most contributed factor to fillet height, also to determine the optimized parameter tooling application for good fillet height performance. Evaluation Experiment Matrix DOE Schedule JMP Analysis JMP Analysis JMP Analysis JMP Analysis JMP Analysis – BLT Fillet Height included Attachment Attachment Attachment Enabling a Microelectronic World? DOE Report for Infineon Fillet Height Issue in D/A DOE Report for Infineon Fillet Height Issue Fillet height: 100% (left side) Fillet height: 81% (right side) DOE Information 1) D.O.E matrix : 4 factor, 2 level for CD, 3 level for others 2) Major Process Para. (Factors) Bond Force : 0.5N, 1.5N, 2.5N mAmps Bond Height : AL B/H-0.32mm, AL B/H, AL B/H+0.32mm Dispense pressure : 30%, 60%, 90% Capillary Diameter : 0.3mm, 0.4mm 3) Response : Fillet Height Value, BLT, Die Tilt, Coverage Raw Material Information -. PKG : MF-07-048 -. Die Information : 2.8*2.55mm Dummy -. Die Bonder M/C : ESEC2008HS 31# -. Epoxy : Sumi 1085A -. Lead Frame : 7*7 body, 5.3SQ Pad, (0501-000832) -. Pick Up Tool : 70*90 mil -. Eject Pin : 4*8 mil DOE Report for Infineon Fillet Height Issue 0.4mm CD 0.3mm CD 70x90 PUT 2.5 AL-0.32 60 0.4 Leg #9 2.5 AL-0.32 30 0.4 Leg #8 0.5 AL 30 0.3 Leg #7 0.4 0.4 0.3 0.3 0.3 0.4 0.3 0.3 0.4 0.3 NA 0.4 CD (mm) 1.5 AL+0.32 90 Leg #12 0.5 AL+0.32 90 Leg #11 2.5 AL 90 Leg #10 0.5 AL-0.32 60 Leg #6 1.5 AL+0.32 30 Leg #5 1.5 AL 60 Leg #4 1.5 AL-0.32 90 Leg #3 2.5 AL+0.32 60 Leg #2 0.5 AL 30 Leg #1 0.5 AL+0.32 30 -1 1.5 AL 60 0 BLT Coverage Tilt Fillet Height Bond Time = 200ms Burst Time = 400ms Dispense Height = 0.078mm Pattern = Cross “X” 2.5 AL-0.32 90 +1 Level BF