原创力文档Effect of Using Nano Encapsulated Phase Change Material on Thermal Performance of Micro Heat Sink.pdf
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Effect of Using Nano Encapsulated Phase Change Material on Thermal Performance of Micro Heat Sink
Effect of Using Nano Encapsulated Phase Change
Material on Thermal Performance of Micro Heat Sink
S. Sabbaghi* and S. Mehravar
Faculty of Advanced Technologies, Dep. of Nano Chemical Eng., Shiraz University, Shiraz, I.R.Iran
(*) Corresponding author: sabbaghi@shirazu.ac.ir
(Received: 07 June 2014 and Accepted: 18 Jan. 2015)
Abstract:
The aim of this paper is to enhance thermal performance of a microchannel heat sink by using nano-
encapsulated phase change material (NEPCM) slurry as a cooling fluid instead of pure fluid. A three-
dimensional model of a circular channel using water slurry of NEPCM was developed. The results
show a significant reduction in the mean fluid temperature along the channel and heat sink wall
temperature under certain conditions for heat flux rates that depend on the NEPCM-slurry volume
fraction and slurry inlet velocity. Lower temperatures across the electronic device can be attained at
high heat flux compared with using water as the only cooling fluid.
Keywords: Heat sink, Latent heat, NEPCM-slurry, Phase change material.
1. INTRODUCTION
One of the effective approaches of advanced
energy technologies to preserve available
energy and improve its applications is the use
of a latent heat storage system utilizing heat
storage material or phase change materials
(PCMs). The heat storage materials have the
ability to alter the status with the small
temperature range. The energy can be
absorbed or released when the materials
temperatures overpass the phase change
temperature during melting and solidifying
processes respectively [1-4]. It is necessary for
the latent heat energy storage to have a PCM
with high thermal conductivity because the
rate of energy release and storage of the PCM
can be hindered with low thermal
conductivity. Progresses in nanotechnology
field have resulted in developments of new
methods for improving thermal conductivity of
PCMs including dispersing high thermal
conductive nanop
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