Influence of residual stress on crack growth.pdf

31 on H. Berns and L.Weber Ruhr- Universitiit Boc/nan West Gernlany ABSTRACT The investigations are carried out using as rolled unmachi- ned and unnotched specimens. The specimens are surface treated by shot-peening, shot-peening under prestress and nitriding to get compressive residual stresses in the surface layer. The loading was done under four-point bending. During fatigue the crack start and growth was followed up until fracture by means of an ultrasonic testing device using surface waves. The resi- dual stress distribution after surface treatment is measured and compared to that after fatigue loading until fracture. The influence of residual stress level and distribution on fatigue crack growth and fatigue life is shown. The correlation between crack growth, residual stress distribution and its modification is explained by a fracture mechanicsmodel. ItrrRODUCTION Cyclic stresses are usually highest at the surface. There- fore the surface condit~on is a most important aspect for a lot of applications in regard to the fatigue life. The possibility to prolong the fatigue life by inducing compressive residual stresses in the surface layer to compensate for tensile loading stresses is known and has been used since a long time. The aim of the present investigation was to add information concerning the interaction between fatigue crack growth and compressive residual surface stresses. The specimens chosen were as rolled, quenched and tempered and subsequently surface trea- ted flat samples. To induce compressive residual stresses shot- peening and nitriding were chosen. By means of ultrasonic sur- face waves it was possible to observe and register on-line the crack initiation and growth during the cyclic four-point-ben- ding-loading of the specimens. The tests were done within the low cycle fatigue range. The residual stress distribution after surface treatment and their arrangement due to the cyclic load- ing will be discussed. 32 SURFACE CONDITION AND FATIGUE FATI