SMD2016自恢复保险.pdfVIP

Revision: A SMD2016 HF Series Surface Mount PTC Devices U.S. Patent#6377467 *Customer should verify the device performance in their specified conditions. 聚鼎科技股份有限公司 Polytronics Technology Corp. 新竹市科學園區工業東四路 24-1 號 24-1,Industry E.4th Rd. Science Park, Hsinchu,Taiwan. TEL:886-3-5643931 FAX:886-3-5644624 E-mail:Sales@.tw Http://.tw Page: 1 of 10 05/09/2008 TM ELECTRICAL CHARACTERISTICS Maximum Time To Trip Resistance Agency Approval Part Number I hold (A) Itrip (A) Vmax (Vdc) I max (A) Pd max. (W) Current (A) Time (Sec.) R min (Ω) R 1max (Ω) UL/CSA TüV SMD2016P030TF 0.30 0.60 60 20 1.40 1.50 3.00 0.500 2.300 SMD2016P050TF 0.55 1.10 60 20 1.40 2.50 5.00 0.200 1.000 SMD2016P100TF 1.10 2.20 15 40 1.40 8.00 0.50 0.100 0.400 SMD2016P100TF/33 1.10 2.20 33 40 1.40 8.00 0.50 0.100 0.400 SMD2016P150TF 1.50 3.00 15 40 1.40 8.00 1.00 0.070 0.180 SMD2016P200TF 2.00 4.20 6 40 1.40 8.00 3.00 0.048 0.100 Note: I hold = Hold current: maximum current device will pass without tripping in 20℃ still air. I trip = Trip current: minimum current at which the device will trip in 20℃ still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) I max = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd = Power dissipated from device when in the tripped state at 20℃ still air. R min= Minimum resistance of device in initial (un-soldered) state. R 1max= Maximum resistance of device at 20℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec. *Value specified were determined using the PWB with 0.090”*1.5oz copper traces. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. ◎Specifications are subject to change without notice.