Sn-Ag-Cu无铅球栅阵列焊点塑性表征.pdfVIP

第 25 卷第 11 期 中国有色金属学报 2015 年 11 月 Volume 25 Number 11 The Chinese Journal of Nonferrous Metals November 2015 文章编号：1004-0609(2015)-11-3119-07 Sn-Ag-Cu无铅球栅阵列焊点塑性表征 杨淼森1, 2，孙凤莲1，孔祥霞1，周云芳1 (1. 哈尔滨理工大学 材料科学与工程学院，哈尔滨 150080； 2. 哈尔滨职业技术学院 机械工程学院，哈尔滨 150081) 摘 要：通过纳米压痕的方法，采用塑性应变与总应变的比值表征塑性，对 SAC305/Cu、SAC0307/Cu 和 SAC0705BiNi/Cu这 3种无铅焊点的动态硬度、抗蠕变性能及塑性进行了对比。3种焊点的动态硬度随深度变化趋 势相同，随着压入深度的增加而降低。SAC0705BiNi/Cu 的最终动态硬度最高，压痕深度最小，SAC305/Cu 表现 出应变硬化现象。3 种焊点的抗蠕变能力由大到小依次为 SAC0705BiNi/Cu、SAC305/Cu、SAC0307/Cu。 SAC0705BiNi/Cu 焊点的塑性与 SAC305/Cu 焊点的相当。与 SAC305 和 SAC0307 两种钎料相比，无铅钎料 SAC0705BiNi通过 Bi和 Ni元素的加入，提高钎料的硬度和抗蠕变性能，并且保持较好的塑性。 关键词：球栅阵列焊点；抗蠕变；塑性；纳米压痕 中图分类号：TG425.1 文献标志码：A Plastic characterization and performance of Sn-Ag-Cu lead-free BGA solder joint YANG Miao-sen1, 2, SUN Feng-lian1, KONG Xiang-xia1, ZHOU Yun-fang1 (1. School of Material Science and Engineering, Harbin University of Technology, Harbin 150080, China; 2. School of Mechanical Engineering, Harbin Vocational and Technical College, Harbin 150081, China) Abstract: The nanoindentation was performed on the plasticity of Sn-Ag-Cu(SAC) lead-free ball grid array(BGA) solder joint. The ratio of plastic strain to total strain was used to characterize the solder plasticity. SAC305/Cu, SAC0307 /Cu and SAC0705BiNi/Cu component solder joints were compared in terms of dynamic hardness, creep resistance and plasticity. The dynamic hardness of three kinds of solder decreases with increasing the penetration depth. For SAC0705BiNi/Cu, the ultimate dynamic hardness is the highest, and the indentation depth is the smallest. Then, the strain hardening phenomenon of SAC305/Cu is more obvious than that of the others. Thus, the order of creep resistance from big to small is SAC0705BiNi/Cu, SAC305/Cu and SAC0307/Cu. The plasticities of SAC0705BiNi/Cu and SAC305/Cu solder joints are similar. Compared with the other two ty