chap.2-new微机电构装系统.ppt

THE ROLE OF PACKAGING IN MICROELECTRONICS;電子構裝技術;電子構裝技術;The Role of Packaging;Different functional roles: - Power distribution: supply power current to devices/chips - Signal distribution: connecting electrical and optical signals from chip to chip or to external devices - Heat dissipation: remove heat from the devices/chips, make system reliable - Package protection: protect devices or chips from environmental or mechanical damages;積體電路製程最重要的步驟，有以下七項。 (l) 單晶成長 (2) 生成矽晶薄膜 (3) 生成絕緣層 (4) 微影蝕刻形成電路圖形　 (5) 摻入電活性雜質及熱處理 　 (6) 製作金屬接面及連線 (7) 切片與構裝;(1)單晶成長 ;矽單晶棒晶元;(4) 微影蝕刻形成電路 圖形 ;(5) 摻入電活性雜質及熱處理 ;(6) 製作金屬接面及連線 ;線接面上金屬矽化物層模截面示意圖 ;(7) 切片與構裝 ;IC: integrated circuit SSI: small scale integration MSI: medium scale integration LSI: large scale integration VLSI: very large scale integration ULSI: ultra scale integration GSI: gigascale integration;半導體構裝元件動向;顯示積體電路從晶圓的拉晶; 製造; 切割; 到構裝完成的簡易流程;Packaging Hierarchy;COB-Chip on Board DCA-Direct Chip Attachment;First level interconnections;晶圓研磨;First level interconnections;;Wire Bonding;TAB-Tape Automated Bonding;Flip Chip;2nd level packaging;IC packages can be classified two categories: 1. through-hole 2. surface mount These two categories refer to the methodology used in assembly the package the printed wiring board (PWB);Classification of IC Packaging;Pin-Through-Hole (PTH) Packaging versus Surface Mount Technology (SMT) Packaging;Through-Hole If the package have pins that can be inserted into holes in the PWB, they are called through-hole packages. Surface mount If the package are not inserted into the PWB, but are mounted on the surface, of the PWB, they are called surface mount packages.;From Through-hole to Surface Mount;2nd level packaging;SMT-Surface Mount Technology;BGA;3rd level and higher packaging;The advantage of the surface mount package, as compared to through-hole, is that both sides of the PWB can be used, and therefore, higher packaging density can be achieved on the board .;CS