研究UV_LIGA微电铸电极过程的交流阻抗法.pdfVIP

15 7 Vol. 15 No. 7 2007 7 Opt ics and Precision Engineering Jul. 2007 1004-924X( 2007) 07- 1049-07 UV-LIGA 1, 2 1, 2 邵力耕 , 杜立群 , 王立鼎 ( 1. 大连理工大学 精密与特种加工教育部重点实验室, 辽宁大连 11602 ; 2. 大连理工大学 辽宁省微 米技术及系统重点实验室, 辽宁大连 11602 ; . 大连交通大学, 辽宁大连 116028) : , , , , , , 2 g/ L, , 0. 171 A/ dm , , : 微电铸; 交流阻抗法; 整平剂; 交换电流密度 :T Q15 .4 :A Study on electrode process of UV-LIGA micro-electroforming by AC impedance method 1, 2 1, 2 SHA O L-i geng , DU L-i qun , WANG L-i ding ( 1. K ey L abor atory of Pr ecision N on-traditional M achining T echnolog y , M inistry of E ducation, D alian Uni ersity of Technology , Dalian 11602 , China; 2. K ey L aboratory of M icro/ N ano T echnology and S y stem of L iaoning P ro ince, Dalian Uni ersity of T echnology , Dalian 11602 , China; . Dalian J iaotong Uni ersity , Dalian 116028, China) Abstract: In order to find out basis factors related w ith metal electrocrystallization of cathode and to take adequate measures to control electrode process of cathode, the electrode process kinetics of micro- electroforming w as studied. Under provided composition of electroforming solution and technology course conditions, the electrode process kinetics of micro-electroforming Ni structure w as studied by AC impedance method. The equivalent circuit of micro-electroforming system w as presented. T hen, the influence of agitation and leveling agent on impedance of electroforming system w as analyzed based on AC impedance chart and