Threshold intensity factors as lower boundaries for crack propagation in ceramics 英文参考文献.docVIP

BioMedical Engineering OnLine BioMedCentral Research Open Access Threshold intensity factors as lower boundaries for crack propagation in ceramics Rudolf Marx*, Franz Jungwirth and Per-Ole Walter Address: Department of Prosthetic Dentistry, Section of Dental Materials, University Hospital of the University of Technology, 52074 Aachen, Germany Email: Rudolf Marx* - marx@rwth-aachen.de; Franz Jungwirth - franz.jungwirth@post.rwth-aachen.de; Per-Ole Walter - per-ole.walter@gmx.de * Corresponding author Published: 17 November 2004 Received: 22 September 2004 Accepted: 17 November 2004 BioMedical Engineering OnLine 2004, 3:41 doi:10.1186/1475-925X-3-41 This article is available from: /content/3/1/41 ? 2004 Marx et al; licensee BioMed Central Ltd. This is an Open Access article distributed under the terms of the Creative Commons Attribution License (/licenses/by/2.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Abstract Background: Slow crack growth can be described in a v (crack velocity) versus KI (stress intensity factor) diagram. Slow crack growth in ceramics is attributed to corrosion assisted stress at the crack tip or at any pre-existing defect in the ceramic. The combined effect of high stresses at the crack tip and the presence of water or body fluid molecules (reducing surface energy at the crack tip) induces crack propagation, which eventually may result in fatigue. The presence of a threshold in the stress intensity factor, below which no crack propagation occurs, has been the subject of important research in the last years. The higher this threshold, the higher the reliability of the ceramic, and consequently the longer its lifetime. Methods: We utilize the Irwin K-field displacement relation to deduce crack tip stress intensity factors from the near crack tip profile. Cracks are initiated by indentation impressions.